Description

Fine Wire Wedge Bonder Details Attached

Configuration

- Bond Head: ● Bonding type: Fine-wire wedge type ● Wire-feed angle: 90-degree (deep-access) ● Transducer frequency: 98 kHz ● Supported material: Both fine wire and ribbon - Spool: ● Applicable spool diameter: 2 × 1 inches - Wire: ● Supported wire diameter: 17.5–50 μm - Work Stage: ● Table specification: Vacuum chuck ● Vacuum chuck mechanism: Yes - Transfer Mechanism: ● Removability: No transport locks are installed. - Power Supply: ● Equipment voltage: 230V 50/60Hz

OEM Model Description

Introducing the Bondjet BJ820: High-Speed Fully Automatic Fine Wire Wedge Bonder. It excels in wire bonding for diverse applications like RF devices, COB, MCM, automotive, etc., with aluminum, gold, or ribbon wire. Unmatched speed, precision, and flexibility make it an industry benchmark. Real-time bond quality monitoring, intelligent automation, and optimized tool change further enhance its capabilities. Up to 7 wires/sec, 1 μm at 3 σ axis repeatability, and a large 305mm x 410mm bonding area. Offers loop length adjustment from 70 µm up to 20 mm.

Documents

Hesse & Knipps Bondjet 820.pdf

HESSE & KNIPPS

BONDJET 820

Verified

Wire / Wedge / Ball Bonder

Last Verified: 5 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

152937

Wafer Sizes:

Unknown

Vintage:

2011

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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