Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASM iHAWK-V bonders are advanced semiconductor bonding machines developed by ASM Assembly Systems, a division of ASM Pacific Technology Ltd. These bonders are specifically designed for high-precision and high-throughput semiconductor assembly processes. Wire BonderDocuments
No documents
ASM
iHAWK-V
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 7 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
142470
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASM iHAWK-V bonders are advanced semiconductor bonding machines developed by ASM Assembly Systems, a division of ASM Pacific Technology Ltd. These bonders are specifically designed for high-precision and high-throughput semiconductor assembly processes. Wire BonderDocuments
No documents