The ASM iHAWK-V bonders are advanced semiconductor bonding machines developed by ASM Assembly Systems, a division of ASM Pacific Technology Ltd. These bonders are specifically designed for high-precision and high-throughput semiconductor assembly processes.

Wire Bonder

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

iHAWK-V

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