Description

Increase production efficiency by 30% Innovative optics and image preview systems for smaller chips Automatic material processing device makes product conversion faster ultra low line arc to 50 μ M larger wire range: 56mm x 70mm when the lead frame width is 80mm PR Look Ahead adopt windows operating system and intelligent user interface (multi language option

Configuration

No Configuration

OEM Model Description

Wire Bonder

Documents

No documents

ASM

iHAWK Xtreme

Verified

Wire / Wedge / Ball Bonder

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

79184

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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