Description
Increase production efficiency by 30% Innovative optics and image preview systems for smaller chips Automatic material processing device makes product conversion faster ultra low line arc to 50 μ M larger wire range: 56mm x 70mm when the lead frame width is 80mm PR Look Ahead adopt windows operating system and intelligent user interface (multi language optionConfiguration
No ConfigurationOEM Model Description
Wire BonderDocuments
No documents
ASM
iHAWK Xtreme
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79184
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
iHAWK Xtreme
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79184
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Increase production efficiency by 30% Innovative optics and image preview systems for smaller chips Automatic material processing device makes product conversion faster ultra low line arc to 50 μ M larger wire range: 56mm x 70mm when the lead frame width is 80mm PR Look Ahead adopt windows operating system and intelligent user interface (multi language optionConfiguration
No ConfigurationOEM Model Description
Wire BonderDocuments
No documents