Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.Documents
No documents
ASM
Eagle AERO
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
114051
Wafer Sizes:
Unknown
Vintage:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
Eagle AERO
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
114051
Wafer Sizes:
Unknown
Vintage:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.Documents
No documents