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ASM EAGLE 60AP
  • ASM EAGLE 60AP
  • ASM EAGLE 60AP
  • ASM EAGLE 60AP
Description
No description
Configuration
No Configuration
OEM Model Description
The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
Documents

No documents

CATEGORY
Wire / Wedge / Ball Bonder

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

76741


Wafer Sizes:

Unknown


Vintage:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM

EAGLE 60AP

verified-listing-icon
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
listing-photo-92a37c16ead7472da43522eaddf32ed7-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

76741


Wafer Sizes:

Unknown


Vintage:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.
Documents

No documents

Similar Listings
View All