Description

No description

Configuration

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OEM Model Description

The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.

Documents

Assembly wirebonder - Specifications.pdf

ASM

EAGLE 60AP

Verified

Wire / Wedge / Ball Bonder

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

96271

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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