Used ASM EAGLE XPRESS GOCU Equipment | Moov

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Marketplace > Wire / Wedge / Ball Bonder > ASM > EAGLE XPRESS GOCU

EAGLE XPRESS GOCU

Category

Wire / Wedge / Ball Bonder

Overview

The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.

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