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ASM EAGLE XPRESS GOCU
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.
    Documents

    No documents

    ASM

    EAGLE XPRESS GOCU

    verified-listing-icon

    Verified

    CATEGORY
    Wire / Wedge / Ball Bonder

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    114003

    Wafer Sizes:

    Unknown

    Vintage:

    2016

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    ASM EAGLE XPRESS GOCU

    ASM

    EAGLE XPRESS GOCU

    Wire / Wedge / Ball Bonder
    Vintage: 2016Condition: Used
    Last VerifiedOver 60 days ago
    ASM EAGLE XPRESS GOCU

    ASM

    EAGLE XPRESS GOCU

    Wire / Wedge / Ball Bonder
    Vintage: 2014Condition: Used
    Last VerifiedOver 30 days ago
    ASM EAGLE XPRESS GOCU

    ASM

    EAGLE XPRESS GOCU

    Wire / Wedge / Ball Bonder
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ASM

    EAGLE XPRESS GOCU

    verified-listing-icon
    Verified
    CATEGORY
    Wire / Wedge / Ball Bonder
    Last Verified: Over 60 days ago
    listing-photo-6ba0479fe6d74177a31673343b117ff4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47507/6ba0479fe6d74177a31673343b117ff4/8f88988382af42e49df6de8fecdc9653_22cfa2cc925145138e58491b82c64eda_mw.jpeg
    listing-photo-6ba0479fe6d74177a31673343b117ff4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47507/6ba0479fe6d74177a31673343b117ff4/55bed92b04424525a4b317579bad0b26_c679b82944044d8d9fec6835315a4da8_mw.jpeg
    listing-photo-6ba0479fe6d74177a31673343b117ff4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47507/6ba0479fe6d74177a31673343b117ff4/1d9155ace988452582d1b892a300783c_c68e314536f94b0f8ad78400ecf4fcee_mw.jpeg
    listing-photo-6ba0479fe6d74177a31673343b117ff4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47507/6ba0479fe6d74177a31673343b117ff4/dd4ff75ae99d4312b86924455cfa38cf_c3e1c166edde46269376f774acc5b68a1201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    114003

    Wafer Sizes:

    Unknown

    Vintage:

    2016

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.
    Documents

    No documents

    Similar Listings
    View All
    ASM EAGLE XPRESS GOCU

    ASM

    EAGLE XPRESS GOCU

    Wire / Wedge / Ball BonderVintage: 2016Condition: UsedLast Verified:Over 60 days ago
    ASM EAGLE XPRESS GOCU

    ASM

    EAGLE XPRESS GOCU

    Wire / Wedge / Ball BonderVintage: 2014Condition: UsedLast Verified:Over 30 days ago
    ASM EAGLE XPRESS GOCU

    ASM

    EAGLE XPRESS GOCU

    Wire / Wedge / Ball BonderVintage: 0Condition: UsedLast Verified:Over 60 days ago