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Description
OxideConfiguration
OxideOEM Model Description
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.Documents
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SCREEN / DNS / DAINIPPON SCREEN
AS-2000
Verified
CATEGORY
Wet Processing / Wafer Cleaning
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
22528
Wafer Sizes:
8"/200mm
Vintage:
2000
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
Available
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View AllSCREEN / DNS / DAINIPPON SCREEN
AS-2000
CATEGORY
Wet Processing / Wafer Cleaning
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
22528
Wafer Sizes:
8"/200mm
Vintage:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
OxideConfiguration
OxideOEM Model Description
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.Documents
No documents