Description

The Velocity™single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge. Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. Watermark-free performance is available with Sahara dry. The Velocity is available in 4 or 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications. System was de-installed in operational condition System is in excellent condition

Configuration

No Configuration

OEM Model Description

4 chamber versions. The Velocity single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge. Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics.