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TEL / TOKYO ELECTRON CELLESTA-i
    Description
    No description
    Configuration
    HF + SC1 + IPA ~~~12CHAMBER
    OEM Model Description
    CELLESTA™ -i for 300mm wafer surface clean processing system provides enhanced productivity and significantly decreased footprint. The system incorporates up to twenty units of cleaning chambers and has much smaller footprint. Furthermore, it is equipped with integrated chemical recycle technology contributing less CoO, physical cleaning function for the particle removal on wafers; all of these functions contribute to achieve higher productivity. Additionally, this platform has excellent system extendibility, which is able to equip advanced bevel clean unit dedicated to wafer periphery and backside clean unit with less chemical consumption. 300mm wafer cleaning system, wet etch, uses hot IPA dry, can hold up to 20 cleaning chambers, 1000 wph throughput, can have bevel clean unit.
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    TEL / TOKYO ELECTRON

    CELLESTA-i

    verified-listing-icon

    Verified

    CATEGORY
    Wet Etch

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    90725


    Wafer Sizes:

    12"/300mm


    Vintage:

    2012

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    TEL / TOKYO ELECTRON CELLESTA-i

    TEL / TOKYO ELECTRON

    CELLESTA-i

    Wet Etch
    Vintage: 0Condition: Used
    Last Verified18 days ago

    TEL / TOKYO ELECTRON

    CELLESTA-i

    verified-listing-icon
    Verified
    CATEGORY
    Wet Etch
    Last Verified: Over 60 days ago
    listing-photo-40176b30b6754344ba86ada793147f6b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    90725


    Wafer Sizes:

    12"/300mm


    Vintage:

    2012


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    HF + SC1 + IPA ~~~12CHAMBER
    OEM Model Description
    CELLESTA™ -i for 300mm wafer surface clean processing system provides enhanced productivity and significantly decreased footprint. The system incorporates up to twenty units of cleaning chambers and has much smaller footprint. Furthermore, it is equipped with integrated chemical recycle technology contributing less CoO, physical cleaning function for the particle removal on wafers; all of these functions contribute to achieve higher productivity. Additionally, this platform has excellent system extendibility, which is able to equip advanced bevel clean unit dedicated to wafer periphery and backside clean unit with less chemical consumption. 300mm wafer cleaning system, wet etch, uses hot IPA dry, can hold up to 20 cleaning chambers, 1000 wph throughput, can have bevel clean unit.
    Documents

    No documents

    Similar Listings
    View All
    TEL / TOKYO ELECTRON CELLESTA-i

    TEL / TOKYO ELECTRON

    CELLESTA-i

    Wet EtchVintage: 0Condition: UsedLast Verified: 18 days ago
    TEL / TOKYO ELECTRON CELLESTA-i

    TEL / TOKYO ELECTRON

    CELLESTA-i

    Wet EtchVintage: 2012Condition: UsedLast Verified: Over 60 days ago
    TEL / TOKYO ELECTRON CELLESTA-i

    TEL / TOKYO ELECTRON

    CELLESTA-i

    Wet EtchVintage: 2012Condition: UsedLast Verified: Over 60 days ago