Description

Single Wafer Processing Install Type is Stand-Alone. Date of last PM is 2014 MAY. The system not On-Line SEZ Spin Processor Model is SP/4300 UI (Front) is present Status Lamp is present Chuck Size (Left) is 12 Chuck Size (Right) is 12 No Flip Module No End Point Detection System Horiba concentration Monitor (HF Monitor) ULPA Filter (Top of Main Unit) FFU Replacement Date is 2013 May Robot Support Plate is Present Robot - CNTRL Filter Replacement Date is 2013 May No Suck Back Box w/NT flow meter & manual reset Number of Load-ports is 4 std Load-port Size (Left) is 12 Load-port Size (Right) is 12 No Load-port Adapters (12->8) No Wafer ID Reader No RFID Reade Chemical Module 1 is ST250 Chemical Delivery System (CDS) is ST250 No Buffer System for Chemical Cabinet No Bulk Chem Delivery system (BCD)_Active No Bulk Chem Delivery system (BCD)_Passive All Cables are present The power box and robot are missing.

Configuration

No Configuration

OEM Model Description

The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.