Description
Wafer Size: 200 and 300mm configurableConfiguration
No ConfigurationOEM Model Description
The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.Documents
No documents
LAM RESEARCH / SEZ
SP323
Verified
CATEGORY
Wet Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
43508
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / SEZ
SP323
CATEGORY
Wet Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
43508
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer Size: 200 and 300mm configurableConfiguration
No ConfigurationOEM Model Description
The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.Documents
No documents