Description
POST METAL CLEAN - ST250Configuration
No ConfigurationOEM Model Description
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.Documents
No documents
Verified
CATEGORY
Wet Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
128195
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / SEZ
SP223
CATEGORY
Wet Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
128195
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
POST METAL CLEAN - ST250Configuration
No ConfigurationOEM Model Description
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.Documents
No documents