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LAM RESEARCH / SEZ DV-PRIME
    Description
    No description
    Configuration
    Single Cleaning
    OEM Model Description
    The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.
    Documents

    No documents

    verified-listing-icon

    Verified

    CATEGORY
    Wet Etch

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    129940


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    LAM RESEARCH / SEZ DV-PRIME

    LAM RESEARCH / SEZ

    DV-PRIME

    Wet Etch
    Vintage: 2007Condition: Used
    Last VerifiedOver 60 days ago

    LAM RESEARCH / SEZ

    DV-PRIME

    verified-listing-icon
    Verified
    CATEGORY
    Wet Etch
    Last Verified: Over 60 days ago
    listing-photo-d5c001dff46b4b3094ee25cfd11b420f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    129940


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Single Cleaning
    OEM Model Description
    The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.
    Documents

    No documents

    Similar Listings
    View All
    LAM RESEARCH / SEZ DV-PRIME

    LAM RESEARCH / SEZ

    DV-PRIME

    Wet EtchVintage: 2007Condition: UsedLast Verified:Over 60 days ago
    LAM RESEARCH / SEZ DV-PRIME

    LAM RESEARCH / SEZ

    DV-PRIME

    Wet EtchVintage: 0Condition: UsedLast Verified:Over 30 days ago
    LAM RESEARCH / SEZ DV-PRIME

    LAM RESEARCH / SEZ

    DV-PRIME

    Wet EtchVintage: 0Condition: UsedLast Verified:Over 60 days ago