DISCO develops, manufactures, and sells precision machines and precision processing tools.

The Disco DCS141 is a spinning unit that cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces. It is appropriate for use with the automatic dicing saw (Disco DAD341) and other machines that lack a cleaning function, allowing cleaning with water and drying.

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DCS141

DCS140

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance

The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the cleaning arm sweep speed and cleaning locations are configurable options) for effective and efficient cleaning. In addition to the standard specification high pressure cleaning nozzle an atomizing cleaning nozzle can be selected. These two different types of cleaning nozzles can be mounted to produce a double cleaning arm configuration, making it possible to clean a wide range of workpieces with a single unit.

DCS1440

DCS1410

Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance

The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the cleaning arm sweep speed and cleaning locations are configurable options) for effective and efficient cleaning. In addition to the standard specification high pressure cleaning nozzle an atomizing cleaning nozzle can be selected. These two different types of cleaning nozzles can be mounted to produce a double cleaning arm configuration, making it possible to clean a wide range of workpieces with a single unit.

DCS1460

Spin cleaning and drying for workpieces processed using dicing saws

Manual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and drying workpieces processed using a semi-automatic dicing saw or other equipment. High-pressure cleaning with a maximum discharge pressure of 11.8 Mpa and user-created cleaning sequences (settings for the cleaning arm swing speed and spinner rotation speed) offer the optimal cleaning operation for a wide range of workpieces. In addition, the rinse cleaning, atomizing cleaning nozzle, and high performance atomizing nozzle specifications can be installed as an option. The DCS1441 can greatly reduce the number of processing particles on a wafer

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Top DISCO Wet Benches - Manual

DCS141

DCS140

DCS1440

DCS1410

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