Overview

the SSEC 3300 family of cutting-edge wet cleaners and processors. Engineered with singular wafer technology, these systems boast application-specific configurations catering to every facet of semiconductor fabrication – from meticulous cleaning and precise coating to intricate development, etching, and solvent processing – all within an entirely digital realm. Supporting wafers up to 300 mm, the Model 3301/2 variants stand as paragons of automation, ensuring operator safety even when handling the most aggressive chemistries through their dry-in/dry-out design. With the option to integrate up to two processing modules, flexibility meets efficiency. Choose between bulkhead or ballroom styles, both employing ULPA filtration to process air within the mini-environment, while the onboard bulk chemical management and blending capability enhances cost-effectiveness, enabling operations with chemistry diluted from concentrated bulk supplies. Adhering to SEMI® ergonomic standards, wafers can be deftly managed in cassettes using horizontal cassette loaders, SMIFs, or standard 300 mm FOUP openers. Redefine possibility – embrace the future with SSEC 3300.