Synergy is a cleaning technology that combines OnTrak’s Double-Sided Scrubbing (DSS®) technology with in-situ chemical etching, resulting in a new level of cleaning called Chemical Mechanical Cleaning (CMC™). This single-step process offers maximum cleaning performance while maintaining high throughput. Synergy makes use of high-purity chemicals to extend cleaning capability to include embedded particle removal, trace metal removal, and damaged oxide layer removal.

LAM RESEARCH CORPORATION

ONTRAK SYNERGY

ONTRAK DSS-200

The DSS 200 Series II is a double-sided PVA scrubber that offers production-proven cleaning results for particles as small as 0.125µm. It can process wafers from 150mm to 200mm, with throughputs of 45-65 wafers per hour, making it a cost-effective wafer cleaning system. The system uses a simple brush scrubbing process to clean wafers, with both sides of the wafer being cleaned simultaneously and no edge exclusion. The unit features edge-only contact and an optional megasonic rinse sweep for effective cleaning results on metals and surface topography. A heat lamp assembly allows for fast dry cycles, with typical results showing a 200mm wafer can be dried in under 15 seconds using only an 1800 rpm spin cycle. At the end of the process, wafers are removed and placed in the output cassette by an edge gripping unload handler, with no contact of the wafer front or backside occurring from the spin module to the output cassette.

ONTRAK DSS200 II

The Synergy Integra™ System is a solution provided by OnTrak for Chemical Mechanical Planarization (CMP) equipment manufacturers. It integrates the CMP polisher and wafer cleaner onto a single platform, improving factory layouts and increasing productivity. The system eliminates the need to move wet wafers between systems, preventing damage that can occur if polishing slurry dries on the wafer. 

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Top LAM RESEARCH CORPORATION Wafer Scrubber

ONTRAK SYNERGY

ONTRAK DSS-200

ONTRAK DSS200 II

ONTRAK SYNERGY INTEGRA

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