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+DFM2700OEM Model Description
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.Documents
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DISCO
DGP8760
CATEGORY
Wafer Polishing
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
125959
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
+DFM2700OEM Model Description
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.Documents
No documents