Description
Spindle(NCPZ-110117)POLISHConfiguration
No ConfigurationOEM Model Description
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.Documents
No documents
DISCO
DGP8760
Verified
CATEGORY
Wafer Polishing
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115340
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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DISCO
DGP8760
CATEGORY
Wafer Polishing
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115340
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Spindle(NCPZ-110117)POLISHConfiguration
No ConfigurationOEM Model Description
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.Documents
No documents