Description
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Back Grinder tape manual mounter for 6 and 8in wafersOEM Model Description
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.Documents
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ULTRON SYSTEMS INC / USI
UH108-8
Verified
CATEGORY
Wafer Lapping
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
90074
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULTRON SYSTEMS INC / USI
UH108-8
Verified
CATEGORY
Wafer Lapping
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
90074
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Back Grinder tape manual mounter for 6 and 8in wafersOEM Model Description
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.Documents
No documents