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ULTRON SYSTEMS INC / USI UH108-8
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    Configuration
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    OEM Model Description
    Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.
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    ULTRON SYSTEMS INC / USI

    UH108-8

    verified-listing-icon

    Verified

    CATEGORY

    Wafer Lapping
    Last Verified: Over 30 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    100506


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    ULTRON SYSTEMS INC / USI UH108-8
    ULTRON SYSTEMS INC / USIUH108-8Wafer Lapping
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ULTRON SYSTEMS INC / USI

    UH108-8

    verified-listing-icon

    Verified

    CATEGORY

    Wafer Lapping
    Last Verified: Over 30 days ago
    listing-photo-1cd9868d41604877ac819a0d1ca313f1-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    100506


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.
    Documents

    No documents

    Similar Listings
    View All
    ULTRON SYSTEMS INC / USI UH108-8
    ULTRON SYSTEMS INC / USI
    UH108-8
    Wafer LappingVintage: 0Condition: UsedLast Verified: Over 60 days ago