Description
Manufacturer: ENGIS Model: EJD-9BL Equipment Type: Double-Sided Lapping & Polishing Machine Lapping Plate Size (OD): 635 mm Carrier Type: DP12 Carrier Outer Diameter: 232.7 mm Lower Plate Speed: 10–40 rpm Main Motor Power: 3.7 kW Drive System: 4-Way Drive Power Supply: AC 200V, 3-Phase, 50/60Hz Machine Dimensions (W x D x H): 1,500 x 1,200 x 2,300 mm Machine Weight (Net): 2,000 kgConfiguration
No ConfigurationOEM Model Description
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.Documents
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ENGIS
EJD-9BL
CATEGORY
Wafer Lapping
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
153616
Wafer Sizes:
Unknown
Vintage:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Manufacturer: ENGIS Model: EJD-9BL Equipment Type: Double-Sided Lapping & Polishing Machine Lapping Plate Size (OD): 635 mm Carrier Type: DP12 Carrier Outer Diameter: 232.7 mm Lower Plate Speed: 10–40 rpm Main Motor Power: 3.7 kW Drive System: 4-Way Drive Power Supply: AC 200V, 3-Phase, 50/60Hz Machine Dimensions (W x D x H): 1,500 x 1,200 x 2,300 mm Machine Weight (Net): 2,000 kgConfiguration
No ConfigurationOEM Model Description
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.Documents
No documents