Description
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The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.Documents
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ENGIS
EJD-9BL
CATEGORY
Wafer Lapping
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
140381
Wafer Sizes:
Unknown
Vintage:
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.Documents
No documents