Description

WAFER GRINDING / GNX200 from ATK(CR17035 L*W*H (cm) -140x255x180 Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um.

Configuration

No Configuration

OEM Model Description

Grinder

Documents

No documents

OKAMOTO

GNX 200

Verified

Wafer Grinding

Last Verified: 14 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

143420

Wafer Sizes:

Unknown

Vintage:

2000

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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listing-photo-c5805bba808940fa90092591508ba05b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/89197/c5805bba808940fa90092591508ba05b/7c752037e491494da2edb3f70fb5d482_p3172464_mw.JPG

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

143420

Wafer Sizes:

Unknown

Vintage:

2000

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

Description

WAFER GRINDING / GNX200 from ATK(CR17035 L*W*H (cm) -140x255x180 Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um.