Description
Grinder thinning machine Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning. Rated power: ac200v, 50 / 60Hz, 21kwv Compressed air: 0.5MPa 350l/mi Grinding water: 0.2MPa 25L / min L cooling water: 0.2MPa 9L / min Weight: 5000kgConfiguration
No ConfigurationOEM Model Description
Discontinued Mar. 2006Documents
No documents
DISCO
DFG860
Verified
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79180
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFG860
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79180
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Grinder thinning machine Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning. Rated power: ac200v, 50 / 60Hz, 21kwv Compressed air: 0.5MPa 350l/mi Grinding water: 0.2MPa 25L / min L cooling water: 0.2MPa 9L / min Weight: 5000kgConfiguration
No ConfigurationOEM Model Description
Discontinued Mar. 2006Documents
No documents