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Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.Documents
No documents
PREFERRED
SELLER
CATEGORY
Wafer Grinding
Last Verified: 13 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
125549
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
DISCO
DFG8340
CATEGORY
Wafer Grinding
Last Verified: 13 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
125549
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The DISCO DFG8340 is a fully automatic in-feed surface grinder designed for high-precision wafer processing. It features a single spindle, dual chuck table, and single turntable structure, enabling efficient grinding of various workpieces up to 8 inches in diameter, including silicon wafers, SiC, sapphire, and ceramics. This grinder is particularly suitable for applications requiring high planarity, such as semiconductor device manufacturing.Documents
No documents