We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
Description
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.Configuration
PG3000RM/200RMOEM Model Description
None ProvidedDocuments
No documents
Verified
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79210
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG3000RM
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79210
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.Configuration
PG3000RM/200RMOEM Model Description
None ProvidedDocuments
No documents