DGP8761
Category
Polishing and GrindingOverview
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.
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- DGP8761Polishing and GrindingVintage: Condition: UsedLast VerifiedOver 30 days ago
- DGP8761Polishing and GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago
- DGP8761Polishing and GrindingVintage: 2009Condition: UsedLast VerifiedOver 60 days ago
- DGP8761Polishing and GrindingVintage: 2010Condition: UsedLast VerifiedOver 60 days ago