Description
-Illumination Source Type Multi-wavelength Source -Multi-Layer Film Capacity YES -Micro Spot Optics YES -Scanning Stage YES -Wafer Mapping YES -Refurbished YES -CE Marked YESConfiguration
Inspection Modes Include: Dual Beam Spectrometry Spectroscopic Ellipsometry Film Stress Analysis SUMMIT™ Application Software Version 3.21.16 FTML Version 3.46.06 Model 300DFF1P Wafer Loading Platform Dual Loadports for 300mm Wafers Three Axis Wafer Handling Robot GEM / SECS Communication Set Size 300 mmOEM Model Description
The ASET-F5x is a thin film metrology system that can measure materials across a continuous wavelength spectrum from 190 nm to 800 nm. It accurately measures complex multi-layer thin film stacks using spectroscopic ellipsometry and precisely measures advanced, ultra-thin gate dielectric films. It provides the accuracy, repeatability, and system-to-system matching required to monitor advanced ICs with geometries as small as 0.1 micron. Its applications include diffusion films/film deposition, CMP, lithography, and etch.Documents
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KLA
ASET-F5x
CATEGORY
Thin Film / Film Thickness
Last Verified: 3 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
149084
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
-Illumination Source Type Multi-wavelength Source -Multi-Layer Film Capacity YES -Micro Spot Optics YES -Scanning Stage YES -Wafer Mapping YES -Refurbished YES -CE Marked YESConfiguration
Inspection Modes Include: Dual Beam Spectrometry Spectroscopic Ellipsometry Film Stress Analysis SUMMIT™ Application Software Version 3.21.16 FTML Version 3.46.06 Model 300DFF1P Wafer Loading Platform Dual Loadports for 300mm Wafers Three Axis Wafer Handling Robot GEM / SECS Communication Set Size 300 mmOEM Model Description
The ASET-F5x is a thin film metrology system that can measure materials across a continuous wavelength spectrum from 190 nm to 800 nm. It accurately measures complex multi-layer thin film stacks using spectroscopic ellipsometry and precisely measures advanced, ultra-thin gate dielectric films. It provides the accuracy, repeatability, and system-to-system matching required to monitor advanced ICs with geometries as small as 0.1 micron. Its applications include diffusion films/film deposition, CMP, lithography, and etch.Documents
No documents