Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Third-generation EUV systems ASML’s TWINSCAN NXE:3400B supports EUV volume production at the 7 and 5 nm nodes. The 300 mm wafer throughput target specification for the NXE:3400B is larger than or equal to 125 wafers per hour under the following conditions: Dose: 20mJ/cm2, die size: 26 x 33 mm, 96 shots.Documents
No documents
Verified
CATEGORY
Steppers & Scanners
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
141961
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASML
TWINSCAN NXE:3400B
CATEGORY
Steppers & Scanners
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
141961
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Third-generation EUV systems ASML’s TWINSCAN NXE:3400B supports EUV volume production at the 7 and 5 nm nodes. The 300 mm wafer throughput target specification for the NXE:3400B is larger than or equal to 125 wafers per hour under the following conditions: Dose: 20mJ/cm2, die size: 26 x 33 mm, 96 shots.Documents
No documents