Overview

Third-generation EUV systems ASML’s TWINSCAN NXE:3400B supports EUV volume production at the 7 and 5 nm nodes. The 300 mm wafer throughput target specification for the NXE:3400B is larger than or equal to 125 wafers per hour under the following conditions: Dose: 20mJ/cm2, die size: 26 x 33 mm, 96 shots.