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HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
  • HITACHI RS-4000
Description
No description
Configuration
No Configuration
OEM Model Description
The RS-4000 performs at a high throughput of 1,200 DPH (defects per hour), which is about 3 times faster than the conventional model, and performs defect review at a high speed and high defect capture rate thereby improving image resolution (3 nm) and enhancing image processing. Combined with ADC (automatic defect classification) to identify killer defects, the tool produces data directly linked with yield enhancement in a short time. Furthermore, the newly added function of tilt image observation by tilting the electron beam enables the tool to generate more defect information.
Documents

No documents

CATEGORY
SEM / FIB

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

106385


Wafer Sizes:

12"/300mm


Vintage:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

HITACHI

RS-4000

verified-listing-icon
Verified
CATEGORY
SEM / FIB
Last Verified: Over 60 days ago
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Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

106385


Wafer Sizes:

12"/300mm


Vintage:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The RS-4000 performs at a high throughput of 1,200 DPH (defects per hour), which is about 3 times faster than the conventional model, and performs defect review at a high speed and high defect capture rate thereby improving image resolution (3 nm) and enhancing image processing. Combined with ADC (automatic defect classification) to identify killer defects, the tool produces data directly linked with yield enhancement in a short time. Furthermore, the newly added function of tilt image observation by tilting the electron beam enables the tool to generate more defect information.
Documents

No documents