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DYNATEX DTX-MDB 150
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.
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    No documents

    DYNATEX

    DTX-MDB 150

    verified-listing-icon

    Verified

    CATEGORY
    Scribing, Cutting, Dicing

    Last Verified: Over 30 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    82126

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

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    Logistics Support
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    DYNATEX DTX-MDB 150

    DYNATEX

    DTX-MDB 150

    Scribing, Cutting, Dicing
    Vintage: 0Condition: Used
    Last VerifiedOver 30 days ago

    DYNATEX

    DTX-MDB 150

    verified-listing-icon
    Verified
    CATEGORY
    Scribing, Cutting, Dicing
    Last Verified: Over 30 days ago
    listing-photo-f3b9987c63814b04a4415a347086fb25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55281/f3b9987c63814b04a4415a347086fb25/bf11b4bf27a74580a7198b38b7e170b8_8469b34c65764bb6a7e5029676d0780b_mw.jpeg
    listing-photo-f3b9987c63814b04a4415a347086fb25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55281/f3b9987c63814b04a4415a347086fb25/fa6ba153dcc6414a92074f07c59ca962_4cb4d1f55fd14419aa6080135dcacf67_mw.jpeg
    listing-photo-f3b9987c63814b04a4415a347086fb25-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55281/f3b9987c63814b04a4415a347086fb25/e82bb76327a24869b3fb8febf706d556_aa1f21a3e57543a29b36236e5a24cf081201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    82126

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.
    Documents

    No documents

    Similar Listings
    View All
    DYNATEX DTX-MDB 150

    DYNATEX

    DTX-MDB 150

    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified: Over 30 days ago