Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.Documents
No documents
DYNATEX
DTX-MDB 150
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82126
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DYNATEX
DTX-MDB 150
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82126
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.Documents
No documents