DTX-MDB 150
Category
Scribing, Cutting, DicingOverview
The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.
Active Listings
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Services
Inspection, Insurance, Appraisal, Logistics
