Description
DISCO DFD641 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD641 Equipment Type: Fully Automatic Dicing Saw Maximum Workpiece Size: 8 inch (203.2 mm) Spindle Configuration: Single Spindle Spindle Type: Synchro Spindle (Air Bearing) Spindle Output: 1.0 kW Spindle Speed: 6,000–60,000 rpm Rated Torque: 0.16 N·m Maximum Blade Size: 61 mm X-axis Cutting Speed: 0.1–450 mm/s Index Step: 0.0001 mm Positioning Accuracy: ±0.003 mm / 210 mm Repeatability: 0.001 mm Automatic Alignment: Yes Machine Dimensions: 1,185 × 1,168 × 1,235 mm Machine Weight: Approx. 1,000 kg Fully automatic dicing saw with automatic wafer loading, alignment, cutting, cleaning, drying, and unloading. Suitable for precision wafer dicing applications. Specifications may vary depending on machine configuration.Configuration
No ConfigurationOEM Model Description
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.Documents
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DISCO
DFD641
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
153634
Wafer Sizes:
Unknown
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
DISCO DFD641 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD641 Equipment Type: Fully Automatic Dicing Saw Maximum Workpiece Size: 8 inch (203.2 mm) Spindle Configuration: Single Spindle Spindle Type: Synchro Spindle (Air Bearing) Spindle Output: 1.0 kW Spindle Speed: 6,000–60,000 rpm Rated Torque: 0.16 N·m Maximum Blade Size: 61 mm X-axis Cutting Speed: 0.1–450 mm/s Index Step: 0.0001 mm Positioning Accuracy: ±0.003 mm / 210 mm Repeatability: 0.001 mm Automatic Alignment: Yes Machine Dimensions: 1,185 × 1,168 × 1,235 mm Machine Weight: Approx. 1,000 kg Fully automatic dicing saw with automatic wafer loading, alignment, cutting, cleaning, drying, and unloading. Suitable for precision wafer dicing applications. Specifications may vary depending on machine configuration.Configuration
No ConfigurationOEM Model Description
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.Documents
No documents