Description
**DISCO DFD641 – Fully Automatic Dicing Saw** **General Specifications** * Manufacturer: DISCO Corporation * Model: DFD641 * Equipment Type: Fully Automatic Dicing Saw * Spindle Configuration: Single Spindle * Maximum Wafer Size: 8-inch (200 mm) **Features** * Automatic wafer frame loading and unloading * Automatic wafer alignment * Fully automatic dicing process * Automatic cleaning and drying * High-output, low-vibration spindle system * Suitable for semiconductor wafer dicing applications *Technical specifications and options should be confirmed according to the actual machine configuration.*Configuration
No ConfigurationOEM Model Description
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.Documents
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DISCO
DFD641
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
153614
Wafer Sizes:
Unknown
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
**DISCO DFD641 – Fully Automatic Dicing Saw** **General Specifications** * Manufacturer: DISCO Corporation * Model: DFD641 * Equipment Type: Fully Automatic Dicing Saw * Spindle Configuration: Single Spindle * Maximum Wafer Size: 8-inch (200 mm) **Features** * Automatic wafer frame loading and unloading * Automatic wafer alignment * Fully automatic dicing process * Automatic cleaning and drying * High-output, low-vibration spindle system * Suitable for semiconductor wafer dicing applications *Technical specifications and options should be confirmed according to the actual machine configuration.*Configuration
No ConfigurationOEM Model Description
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.Documents
No documents