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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DFD6363
    Description
    Wafer Dicing Saw
    Configuration
    No Configuration
    OEM Model Description
    The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.
    Documents

    No documents

    DISCO

    DFD6363

    verified-listing-icon

    Verified

    CATEGORY
    Scribing, Cutting, Dicing

    Last Verified: 16 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    116264


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DFD6363

    DISCO

    DFD6363

    Scribing, Cutting, Dicing
    Vintage: 0Condition: Used
    Last Verified16 days ago

    DISCO

    DFD6363

    verified-listing-icon
    Verified
    CATEGORY
    Scribing, Cutting, Dicing
    Last Verified: 16 days ago
    listing-photo-e49f874eb4374740b75593ee3f8b9d7b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    116264


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Wafer Dicing Saw
    Configuration
    No Configuration
    OEM Model Description
    The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFD6363

    DISCO

    DFD6363

    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified:16 days ago
    DISCO DFD6363

    DISCO

    DFD6363

    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified:16 days ago
    DISCO DFD6363

    DISCO

    DFD6363

    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified:16 days ago