Description
Wafer Dicing SawConfiguration
No ConfigurationOEM Model Description
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.Documents
No documents
DISCO
DFD6363
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116264
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFD6363
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116264
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer Dicing SawConfiguration
No ConfigurationOEM Model Description
The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.Documents
No documents