Description

Wafer Saw

Configuration

300mm Fully Automatic Dicing Saw Includes: 1.2 KW Facing dual-spindle Touch panel LCD CE-Mark and EMC Conformity Standard Accessories Tape Frame (DFT2-12 Type - Frame thickness 1.5mm) Cassette (DTC212 Type 300mm 13-slot standard cassette) Spare Porous Chuck table for 200mm Spare Spinner Table for 200mm Spinner Atomizing Nozzle Type HC2 (High Clean Version 2 Type) Non-Contact Setup Lifting Jig Set Power Cable Transformer specification (AC380 to 415V) 7m Transformer Unit Uninterruptible Power Supply CO2 Injector (internal Type) Stayclean Injector Kerf Center Alignment EMO Guard Ring Stylus Pen Magnet Fixing type Water Temperature Control Unit DTU1550 Includes: Power cable 7m Piping Assy Digital Flowmeter for chiller Status Indicator EMO Guard Ring

OEM Model Description

The DFD6362 is a fully automatic dicing saw made by Disco Corporation. It is designed for improved productivity with Φ300 mm wafers and has a facing dual spindle. It offers higher dual cut processing speed due to the shortened distance between the spindles and various new functions.