Description
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2.2kW Standard Wafer SawingOEM Model Description
The DFD6362 is a fully automatic dicing saw made by Disco Corporation. It is designed for improved productivity with Φ300 mm wafers and has a facing dual spindle. It offers higher dual cut processing speed due to the shortened distance between the spindles and various new functions.Documents
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DISCO
DFD6362
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
73255
Wafer Sizes:
Unknown
Vintage:
2016
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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DISCO
DFD6362
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
73255
Wafer Sizes:
Unknown
Vintage:
2016
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
2.2kW Standard Wafer SawingOEM Model Description
The DFD6362 is a fully automatic dicing saw made by Disco Corporation. It is designed for improved productivity with Φ300 mm wafers and has a facing dual spindle. It offers higher dual cut processing speed due to the shortened distance between the spindles and various new functions.Documents
No documents