Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Fully-autoOEM Model Description
The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.Documents
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DISCO
DFD6340
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116462
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFD6340
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116462
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Fully-autoOEM Model Description
The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.Documents
No documents