Description
- System Version: Windows NT - Corresponding Production Products: Altion SMD2 1X2, Altion H1K 1X2, Altion C2 1X4, Luxeon FX CW - Single Spindle: 1.8KW - Has BBD (Broken Blade Detector) and NCS (Non-contact Setup) - 6 inch porous chuck table (butterfly shape) - Barcode Scanner IncludedConfiguration
No ConfigurationOEM Model Description
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.Documents
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DISCO
DAD3350
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
78916
Wafer Sizes:
Unknown
Vintage:
2004
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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DISCO
DAD3350
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
78916
Wafer Sizes:
Unknown
Vintage:
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
- System Version: Windows NT - Corresponding Production Products: Altion SMD2 1X2, Altion H1K 1X2, Altion C2 1X4, Luxeon FX CW - Single Spindle: 1.8KW - Has BBD (Broken Blade Detector) and NCS (Non-contact Setup) - 6 inch porous chuck table (butterfly shape) - Barcode Scanner IncludedConfiguration
No ConfigurationOEM Model Description
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.Documents
No documents