Description
Wafer dicing sawConfiguration
- Workplace size (mm) : ø150 - Spindle Layout : Single - Spindle Output (kw) : 1.5 at 30,000 min-1 - Spindle Max. revolution speed (min-1) : 40,000 - X-axis Feed speed range (mm/s) : 0.1 - 500 - Y-axis Index step (mm) : 0.0001 - Y-axis Positioning accuracy (mm) : - Z-axis Repeating accuracy (mm) : 0.001 - Z-axis Max. blade size (mm) : ø58OEM Model Description
The DAD3220 is an automatic dicing saw designed for compactness and compatible with 6 × 6-inch workpieces using a user-specified specification. It has a Φ150 mm single spindle and features an LCD touch panel with a graphical user interface for easy and intuitive operation.Documents
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DISCO
DAD3220
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
66767
Wafer Sizes:
8"/200mm
Vintage:
2011
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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View AllDISCO
DAD3220
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
66767
Wafer Sizes:
8"/200mm
Vintage:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer dicing sawConfiguration
- Workplace size (mm) : ø150 - Spindle Layout : Single - Spindle Output (kw) : 1.5 at 30,000 min-1 - Spindle Max. revolution speed (min-1) : 40,000 - X-axis Feed speed range (mm/s) : 0.1 - 500 - Y-axis Index step (mm) : 0.0001 - Y-axis Positioning accuracy (mm) : - Z-axis Repeating accuracy (mm) : 0.001 - Z-axis Max. blade size (mm) : ø58OEM Model Description
The DAD3220 is an automatic dicing saw designed for compactness and compatible with 6 × 6-inch workpieces using a user-specified specification. It has a Φ150 mm single spindle and features an LCD touch panel with a graphical user interface for easy and intuitive operation.Documents
No documents