Description

The AG Associates Heatpulse8800 rapid thermal anneal system contains a subsystem for each of the following: • Electronics (including a dedicated microprocessor) • Mass-flow-controlled gas handling • Cooling • ULPA filtration • Mechanical assemblies AG Associates Heatpulse 8800 Rapid Thermal Anneal equipment APPLICATIONS: The Heatpulse 8800 system is a versatile tool which can be useful for many applications, such as (but not limited to): • Silicon dielectric growth • Implant annealing • Glass re-flow • Silicide formation and annealing • Nitridation of metals • Contact alloying • Oxygen donor annihilation

Configuration

The following are the operating specifications for the Heatpulse® 8800 system. Wafer handling: automatic serial processing, using standard cassettes. Throughput: Process dependent, approximately 80 wafers per hour (in a null cycle) without flat-finder. Wafer sizes: 5 inches, 6 inches, and 8 inches (standard). Ramp-up rate: Programmable, 1 – 180°C per second. Steady-state duration: 1 – 600 seconds per step. Ramp-down rate: Programmable, 1 – 180°C per second. Ramp-down rate is temperature and radiation dependent, maximum 150°C per second. Recommended steady-state temperature range: 400 – 1200°C. ERP temperature accuracy: +3°C to -7°C, when calibrated against an instrumented thermocouple wafer (ITC). Temperature repeatability: + 3°C or better at 1150°C wafer to wafer. (Repetition specifications are based on a 100-wafer set.) Temperature uniformity: + 5°C across an 8-inch wafer at 1150°C. (This is a 1-sigma deviation from 100-angstrom oxide uniformity.) For a titanium silicidation process, no more than 1.5 percent increase to uniformity during the first anneal at 650 – 700°C.

OEM Model Description

The Heatpulse 8800 system is a single-wafer, cassette-to-cassette rapid thermal processor, capable of processing in inert or corrosive ambient. The system is built for the production environment.Process Chamber accommodates 125mm to 200mm wafers, with standard slip-free ring and wafer aligner.