Description
RTPConfiguration
No ConfigurationOEM Model Description
The 2900 RTP system addresses 0.25-0.13 micron RTP applications at, what STEAG believes to be, the best cost of ownership in the industry. It incorporates the advanced capabilities of the 3000 RTP tool and the field proven capabilities of the 2800 and 8800 systems. Applications include silicide/barrier formation, BPSG reflow and densification, thin gate dielectrics, thermal donor annihilation and multilayer annealing.Documents
No documents
Verified
CATEGORY
RTP/RTA
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
130858
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MATTSON / STEAG / AST
2900
CATEGORY
RTP/RTA
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
130858
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
RTPConfiguration
No ConfigurationOEM Model Description
The 2900 RTP system addresses 0.25-0.13 micron RTP applications at, what STEAG believes to be, the best cost of ownership in the industry. It incorporates the advanced capabilities of the 3000 RTP tool and the field proven capabilities of the 2800 and 8800 systems. Applications include silicide/barrier formation, BPSG reflow and densification, thin gate dielectrics, thermal donor annihilation and multilayer annealing.Documents
No documents