The 2900 RTP system addresses 0.25-0.13 micron RTP applications at, what STEAG believes to be, the best cost of ownership in the industry. It incorporates the advanced capabilities of the 3000 RTP tool and the field proven capabilities of the 2800 and 8800 systems. Applications include silicide/barrier formation, BPSG reflow and densification, thin gate dielectrics, thermal donor annihilation and multilayer annealing.

A supplier of advanced process equipment used to manufacture semiconductors, announced the successful completion to the merger between Mattson Technology, the semiconductor equipment division of STEAG Electronic Systems AG and CFM Technologies, Inc. 

In March 1999, STEAG acquired AG Associates, Inc. and combined its operations with the former AST Elektronik, which it acquired in 1996, to form STEAG RTP Systems. AG Associates was the first company to introduce products utilizing rapid thermal processing technology.

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