Overview

The TCP 9400SEII is a high-density, low-pressure etch system from Lam Research’s TCP product line. It was introduced in late 1992 and incorporates the company’s patented Transformer Coupled Plasma source technology for etching 0.25 micron and smaller geometries. The system is designed for polysilicon, polycide, and shallow trench isolation etch applications. It operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. Independent power control to the lower electrode improves etch results across a wider process window. The TCP 9400SEII is designed to offer customers a reliable, lower cost of ownership solution for their advanced processing needs and is available as a stand-alone, single wafer configuration or in conjunction with the Alliance multi-chamber cluster platform.