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LAM RESEARCH CORPORATION TCP 9400DSiE
    Description
    Polysilicon Etch
    Configuration
    Alliance (A6) TCP 9400DSiE -Qty 1 - A6 Platform -Qty 3 - 9400DSiE Chambers 94-1608(F119229-PM2) 94-1673(F137127-PM1) 94-1609(F119229-PM4)
    OEM Model Description
    The TCP 9400DSiE is a deep silicon etch system designed for high-volume production. It offers broad process capability and flexibility for MEMS, advanced packaging, and power semiconductor applications. The system is based on Lam’s TCP 9400 Etch Series and features a patented TCP plasma source for uniform ion flux and high cross-wafer uniformity. Lam’s Waferless AutoClean technology maintains a consistent chamber environment for superior process stability. With over 1,300 chambers installed worldwide, the TCP 9400DSiE is a reliable choice for meeting the challenges of Si DRIE.
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    LAM RESEARCH CORPORATION

    TCP 9400DSiE

    verified-listing-icon

    Verified

    CATEGORY
    RIE

    Last Verified: Over 30 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    83169

    Wafer Sizes:

    6"/150mm

    Vintage:

    2009

    Have Additional Questions?
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    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    LAM RESEARCH CORPORATION

    TCP 9400DSiE

    verified-listing-icon
    Verified
    CATEGORY
    RIE
    Last Verified: Over 30 days ago
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    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    83169

    Wafer Sizes:

    6"/150mm

    Vintage:

    2009

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Polysilicon Etch
    Configuration
    Alliance (A6) TCP 9400DSiE -Qty 1 - A6 Platform -Qty 3 - 9400DSiE Chambers 94-1608(F119229-PM2) 94-1673(F137127-PM1) 94-1609(F119229-PM4)
    OEM Model Description
    The TCP 9400DSiE is a deep silicon etch system designed for high-volume production. It offers broad process capability and flexibility for MEMS, advanced packaging, and power semiconductor applications. The system is based on Lam’s TCP 9400 Etch Series and features a patented TCP plasma source for uniform ion flux and high cross-wafer uniformity. Lam’s Waferless AutoClean technology maintains a consistent chamber environment for superior process stability. With over 1,300 chambers installed worldwide, the TCP 9400DSiE is a reliable choice for meeting the challenges of Si DRIE.
    Documents

    No documents

    Similar Listings
    View All

    No Similar Listings