Description
440x120x150 1,200.00Configuration
No ConfigurationOEM Model Description
The UP1200 is a multi-purpose, continuous flow, Reflow Soldering Oven capable of temperatures up to 400°C. Designed to process up to 300mm wafers and any application requiring full chamber cover gas with <5ppm O2 levels across all zones, virtually no vibration, and complete profile customization. Utilizing Sikama’s unique contact conduction heating in combination with thermal convection and radiant heating which provides unmatched thermal energy transfer and the lowest energy use of any comparable reflow oven. This product is CE certified and meets SEMI safety and ergometric standards.Documents
No documents
SIKAMA
UP1200
CATEGORY
Reflow Oven
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
137907
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
440x120x150 1,200.00Configuration
No ConfigurationOEM Model Description
The UP1200 is a multi-purpose, continuous flow, Reflow Soldering Oven capable of temperatures up to 400°C. Designed to process up to 300mm wafers and any application requiring full chamber cover gas with <5ppm O2 levels across all zones, virtually no vibration, and complete profile customization. Utilizing Sikama’s unique contact conduction heating in combination with thermal convection and radiant heating which provides unmatched thermal energy transfer and the lowest energy use of any comparable reflow oven. This product is CE certified and meets SEMI safety and ergometric standards.Documents
No documents